Abstract
A possible scenario for wafer-based silicon photovoltaics is the processing of solar modules starting from thin silicon wafers bonded to glass. However, interactions between the adhesive used for bonding and the solar cell processing can affect the surface passivation of the bonded wafer and decrease cell performances. A method that suppresses these interactions and leads to state-of-the-art a-Si:H surface passivation is presented in this Letter. The method is based on an increase of the surface cross-linking of a silicone adhesive by means of an O2 plasma and it is successfully tested on three different silicones.
| Original language | English |
|---|---|
| Pages (from-to) | 395-398 |
| Number of pages | 4 |
| Journal | Physica Status Solidi - Rapid Research Letters |
| Volume | 8 |
| Issue number | 5 |
| DOIs | |
| State | Published - May 2014 |
Keywords
- Amorphous silicon
- Silicone
- Solar cells
- Solar modules
- Surface passivation
- Thin films
Funding Agency
- Kuwait Foundation for the Advancement of Sciences