Silicon interposer with integrated antenna array for millimeter-wave short-range communications

L. Dussopt; Y. Lamy; S. Joblot; J. Lanteri; H. Salti; P. Bar; H. Sibuet; B. Reig; J. F. Carpentier; C. Dehos; P. Vincent

doi:10.1109/MWSYM.2012.6259424

Silicon interposer with integrated antenna array for millimeter-wave short-range communications

L. Dussopt, Y. Lamy, S. Joblot, J. Lanteri, H. Salti, P. Bar, H. Sibuet, B. Reig, J. F. Carpentier, C. Dehos, P. Vincent

Australian University - Kuwait

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › peer-review

25 Scopus citations

Abstract

A 60 GHz cavity-backed antenna array integrated on high-resistivity silicon is demonstrated. The antenna design makes use of Through-Silicon-Vias (TSV), silicon micromachining, and wafer-to-wafer bonding to meet the bandwidth and radiation gain requirements for short-range multi-Gbps communications. The fabrication process is presented. Simulated and experimental results show that the antenna element covers easily the 57-66 GHz standard band with good impedance matching and more than 5 dBi of gain. Several fixed-beam four-element antenna arrays demonstrate the capabilities for beam-steering across a range up to ±60°.

Original language	English
Title of host publication	IMS 2012 - 2012 IEEE MTT-S International Microwave Symposium
DOIs	https://doi.org/10.1109/MWSYM.2012.6259424
State	Published - 2012
Event	2012 IEEE MTT-S International Microwave Symposium, IMS 2012 - Montreal, QC, Canada Duration: 17 Jun 2012 → 22 Jun 2012

Publication series

Name	IEEE MTT-S International Microwave Symposium Digest
ISSN (Print)	0149-645X

Conference

Conference	2012 IEEE MTT-S International Microwave Symposium, IMS 2012
Country/Territory	Canada
City	Montreal, QC
Period	17/06/12 → 22/06/12

Keywords

Antenna arrays
Integrated circuit packaging
Millimeter wave communication
Millimeter-wave technology
Silicon
Wafer-scale integration

Funding Agency

Kuwait Foundation for the Advancement of Sciences

UN SDGs

This output contributes to the following UN Sustainable Development Goals (SDGs)

Access to Document

10.1109/MWSYM.2012.6259424

Cite this

Dussopt, L., Lamy, Y., Joblot, S., Lanteri, J., Salti, H., Bar, P., Sibuet, H., Reig, B., Carpentier, J. F., Dehos, C., & Vincent, P. (2012). Silicon interposer with integrated antenna array for millimeter-wave short-range communications. In IMS 2012 - 2012 IEEE MTT-S International Microwave Symposium Article 6259424 (IEEE MTT-S International Microwave Symposium Digest). https://doi.org/10.1109/MWSYM.2012.6259424

@inproceedings{fe7c129b695f465ebc4862867fc2f099,

title = "Silicon interposer with integrated antenna array for millimeter-wave short-range communications",

abstract = "A 60 GHz cavity-backed antenna array integrated on high-resistivity silicon is demonstrated. The antenna design makes use of Through-Silicon-Vias (TSV), silicon micromachining, and wafer-to-wafer bonding to meet the bandwidth and radiation gain requirements for short-range multi-Gbps communications. The fabrication process is presented. Simulated and experimental results show that the antenna element covers easily the 57-66 GHz standard band with good impedance matching and more than 5 dBi of gain. Several fixed-beam four-element antenna arrays demonstrate the capabilities for beam-steering across a range up to ±60°.",

keywords = "Antenna arrays, Integrated circuit packaging, Millimeter wave communication, Millimeter-wave technology, Silicon, Wafer-scale integration",

author = "L. Dussopt and Y. Lamy and S. Joblot and J. Lanteri and H. Salti and P. Bar and H. Sibuet and B. Reig and Carpentier, {J. F.} and C. Dehos and P. Vincent",

note = "Funding Information: The authors wish to gratefully acknowledge the partially funding of these studies by Kuwait Fund for the Advancement of Sciences (KFAS).; 2012 IEEE MTT-S International Microwave Symposium, IMS 2012 ; Conference date: 17-06-2012 Through 22-06-2012",

year = "2012",

doi = "10.1109/MWSYM.2012.6259424",

language = "English",

isbn = "9781467310871",

series = "IEEE MTT-S International Microwave Symposium Digest",

booktitle = "IMS 2012 - 2012 IEEE MTT-S International Microwave Symposium",

}

Dussopt, L, Lamy, Y, Joblot, S, Lanteri, J, Salti, H, Bar, P, Sibuet, H, Reig, B, Carpentier, JF, Dehos, C & Vincent, P 2012, Silicon interposer with integrated antenna array for millimeter-wave short-range communications. in IMS 2012 - 2012 IEEE MTT-S International Microwave Symposium., 6259424, IEEE MTT-S International Microwave Symposium Digest, 2012 IEEE MTT-S International Microwave Symposium, IMS 2012, Montreal, QC, Canada, 17/06/12. https://doi.org/10.1109/MWSYM.2012.6259424

Silicon interposer with integrated antenna array for millimeter-wave short-range communications. / Dussopt, L.; Lamy, Y.; Joblot, S. et al.
IMS 2012 - 2012 IEEE MTT-S International Microwave Symposium. 2012. 6259424 (IEEE MTT-S International Microwave Symposium Digest).

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › peer-review

TY - GEN

T1 - Silicon interposer with integrated antenna array for millimeter-wave short-range communications

AU - Dussopt, L.

AU - Lamy, Y.

AU - Joblot, S.

AU - Lanteri, J.

AU - Salti, H.

AU - Bar, P.

AU - Sibuet, H.

AU - Reig, B.

AU - Carpentier, J. F.

AU - Dehos, C.

AU - Vincent, P.

N1 - Funding Information: The authors wish to gratefully acknowledge the partially funding of these studies by Kuwait Fund for the Advancement of Sciences (KFAS).

PY - 2012

Y1 - 2012

N2 - A 60 GHz cavity-backed antenna array integrated on high-resistivity silicon is demonstrated. The antenna design makes use of Through-Silicon-Vias (TSV), silicon micromachining, and wafer-to-wafer bonding to meet the bandwidth and radiation gain requirements for short-range multi-Gbps communications. The fabrication process is presented. Simulated and experimental results show that the antenna element covers easily the 57-66 GHz standard band with good impedance matching and more than 5 dBi of gain. Several fixed-beam four-element antenna arrays demonstrate the capabilities for beam-steering across a range up to ±60°.

AB - A 60 GHz cavity-backed antenna array integrated on high-resistivity silicon is demonstrated. The antenna design makes use of Through-Silicon-Vias (TSV), silicon micromachining, and wafer-to-wafer bonding to meet the bandwidth and radiation gain requirements for short-range multi-Gbps communications. The fabrication process is presented. Simulated and experimental results show that the antenna element covers easily the 57-66 GHz standard band with good impedance matching and more than 5 dBi of gain. Several fixed-beam four-element antenna arrays demonstrate the capabilities for beam-steering across a range up to ±60°.

KW - Antenna arrays

KW - Integrated circuit packaging

KW - Millimeter wave communication

KW - Millimeter-wave technology

KW - Silicon

KW - Wafer-scale integration

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DO - 10.1109/MWSYM.2012.6259424

M3 - Conference contribution

AN - SCOPUS:84866782526

SN - 9781467310871

T3 - IEEE MTT-S International Microwave Symposium Digest

BT - IMS 2012 - 2012 IEEE MTT-S International Microwave Symposium

T2 - 2012 IEEE MTT-S International Microwave Symposium, IMS 2012

Y2 - 17 June 2012 through 22 June 2012

ER -

Silicon interposer with integrated antenna array for millimeter-wave short-range communications

Abstract

Publication series

Conference

Keywords

Funding Agency

UN SDGs

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